WP3 – High Voltage Packaging
| Lead Beneficiary | Start month | End month |
|---|---|---|
| DeepC | 3 | 42 |
Objectives
- This workpackage is concerned with the design, development and testing of a new 15kV SiC component module. The general objective is to integrate in a complete packaging an optimal configuration of SiC dies adapted to the needs of the final power converter application;
- The specifications of this new module will be based on the conclusions of WP1, and a complete validation will be carried out before its delivery to WP6 for the construction of the power converter, and to WP4 for reliability studies;
- First characterizations will be done with alternative factice dies, before final tests with the 15kV dies in the second part of the project.
Tasks
| Task# | Task name | Task leader | Participants |
|---|---|---|---|
| 3.1 | Predesign of the specific Power Module (M3-M15) | CSIC | HE, UCAM, DeepC |
| 3.2 | Design the specific Power Module (M15-M22) | DeepC | UCAM, CSIC |
| 3.3 | Manufacturing and tests of Power Modules (M22-M42) | DeepC | CSIC, SuperGrid Institute |
Deliverables
| Deliverable# | Deliverable name | Lead beneficiary | Type | Due date (in months) |
|---|---|---|---|---|
| D3.1 | Report of pre-design and technologic feasibility | CSIC | Demonstrator, pilot, prototype | 31 |
| D3.2 | Design report of a 15kV SiC IGBT Power Module | DeepC | Document, report | 22 |
| D3.3 | Report of characterization of High Voltage Power Module | DeepC | Document, report | 24 |
Milestones
| Milestone# | Milestone name | Lead beneficiary | Means of verification | Due date (in months) |
|---|---|---|---|---|
| 2 | Preliminary Design Review of High Voltage Technology choices | DeepC | Split Substrate re-use for epi growth | 15 |
| 6 | Manufacturing feasibility | DeepC | Flowchart process checking | 26 |
